peek material 125 mm 12 slots wafer carrier

2A shows a cross-sectional portion of a substrate carrier containing substrates loaded in the substrate carrier įIG. 1B shows a front-opening unified-pod (FOUP), usable with various embodiments of the disclosed subject matter įIG. 1A shows a substrate carrier, usable with various embodiments of the disclosed subject matter įIG. Various ones of the appended drawings merely illustrate example implementations of the present disclosure and should not be considered as limiting its scope.įIG. The detecting includes capturing one or more images of the portion of the substrates and the locations proximate to the portion of the substrates, transferring the one or more images to a pre-trained deep-convolutional neural-network, classifying the state of the portion of the substrates within the locations within the substrate carrier from the images using the pre-trained deep-convolutional neural-network, and providing an automatic tagging of each of the plurality of locations within the substrate carrier that are proximate to the portion of the plurality of substrates. In various embodiments, the disclosed subject matter is a computer-readable medium containing instructions that, when executed by a machine, cause the machine to perform operations including detecting at least a portion of the substrates in the substrate carrier. The data-collection and control system includes one or more hardware-based processors of a machine coupled to the camera and is arranged to transfer the one or more images to a deep-convolutional neural-network, classify a state of the portion of the imaged ones of the substrates within the locations of the substrate within the substrate carrier from the one or more images using the deep-convolutional neural-network, and provide an automatic tagging of each of the locations of the substrates within the substrate carrier that are proximate to the portion of the imaged ones of the substrates. The one or more images include a relationship of the substrates and locations of the substrates relative to a number of substrate slots in the substrate carrier.

The substrate-mapping system includes a camera to collect one or more images of substrates and potential locations of substrates in a substrate carrier, and a data-collection and control system. In various embodiments, the disclosed subject matter is a substrate-mapping system. The method includes detecting at least a portion of the substrates in the substrate carrier. In various embodiments, the disclosed subject matter is a method for classifying a state of a number of substrates within locations in a substrate carrier. The images are then processed with a deep-convolutional neural-network to classify a state of the substrate slot of the carrier including empty slots, occupied slots (e.g., properly loaded slots), double-loaded slots, cross-slotted, and protruded (where a substrate is not fully loaded into a slot).

In various examples provided herein, an image acquisition system, such as a camera, acquires one or more images of the substrates within the carrier. This document describes, among other things, the mapping of substrates within a substrate carrier, and a classification of a state of each substrate, as well as the carrier in which the substrate are placed. However, prior to starting an operation, it is desirable to know if all substrates within a carrier are loaded properly within the carrier, and which substrate slots within the carrier are occupied by a substrate. Various types of substrates, such as semiconductor wafers, are typically placed into various types of substrate carriers, such as a wafer cassette, for processing and metrology operations within a fabrication facility (e.g., such as an integrated circuit manufacturing facility). More specifically, in various embodiments, the disclosed subject matter is related to a mapping system that is able to determine a classification state of substrate (e.g., wafers) with a substrate carrier (e.g., a wafer cassette). The disclosed subject matter is related generally to the field of substrate-inspection and metrology tools used in the semiconductor and allied industries (e.g., flat-panel display and solar-cell production facilities).

Peek material 125 mm 12 slots wafer carrier